| 摘要 |
PROBLEM TO BE SOLVED: To achieve further thinning.SOLUTION: A solid-state imaging device is configured to include: a solid-state imaging element for outputting an image signal corresponding to the quantity of light received by a light receiving surface; a semiconductor element for subjecting the image signal outputted from the solid-state imaging element to signal processing; and a substrate electrically connected to the solid-state imaging element and the semiconductor element. The semiconductor element is sealed with a mold resin in a state of being stored in a storage area provided in the substrate, and the solid-state imaging element is laminated on the semiconductor element via the mold resin. This technique is applicable, for example, to a solid-state imaging device having a structure in which a solid-state imaging element and a semiconductor element are laminated. |
