发明名称 SOLDERING DEVICE AND METHOD
摘要 PROBLEM TO BE SOLVED: To provide a soldering device which ensures reliability or certainty by confirming various conditions of soldering when starting the device or the like. ! SOLUTION: The device for performing soldering on a through hole of a printed circuit board by means of a cylindrical soldering iron 20 includes: a nozzle unit 17 for keeping the soldering iron 20 at a predetermined temperature; a transportation unit 4 for transporting the nozzle unit 17 in X, Y and Z directions to move to a predetermined position; a solder supply unit 10 for supplying a predetermined supply quantity of solders to the soldering iron 20; a floating unit 3 for keeping a load of the soldering iron 20 applied to the printed circuit board when performing soldering upon the printed circuit board; and inspection means 60 for inspecting the temperature of the soldering iron 20, a position of the soldering iron 20, the load of the soldering iron 20 and the quantity of solders to be supplied in predetermined timing and storin
申请公布号 JP2015115427(A) 申请公布日期 2015.06.22
申请号 JP20130255760 申请日期 2013.12.11
申请人 PARAT CO LTD 发明人 MURATA KATSUNORI
分类号 H05K3/34;B23K1/00;B23K3/00;B23K3/06 主分类号 H05K3/34
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