发明名称 LASER PROCESSOR PROCESSING HEAD AND LASER PROCESSOR
摘要 PROBLEM TO BE SOLVED: To provide a laser processor processing head capable of distributing a shield gas supplied from a flexible tube to a main gas flowing from an exit port toward the inner wall of a pipe and to a side gas flowing along the inner wall at a desired flow rate.SOLUTION: A gas distribution part 40 of a processing head has a distribution passage 45 that shunts a part of a shield gas to flow it toward the outflow port of a gas nozzle 50 as a side gas. The processing head has a long screw 60 capable of varying a flow rate of the gas flowing through the distribution passage 45 by being mounted in the gas distribution part 40 to block at least a part of the distribution passage 45. A flow rate of the side gas passing through the distribution passage 45 to the outflow port of the gas nozzle 50 is adjusted by adjusting the number of long screws 60 to be mounted, so that a flow ratio of the main gas to the side gas can be adjusted. A short screw 62 is mounted in a mounting hole 46 in which no long screws 60 are mounted.
申请公布号 JP2015112623(A) 申请公布日期 2015.06.22
申请号 JP20130256277 申请日期 2013.12.11
申请人 TOSHIBA CORP 发明人 HINO TAKEHISA ; MATSUDA HISASHI ; KONO WATARU ; SATO KATSUHIKO ; KAWAJIRI YUKO ; TAMURA MASAKI
分类号 B23K26/064;B23K26/14 主分类号 B23K26/064
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