| 摘要 |
PROBLEM TO BE SOLVED: To provide a prepreg that has a high glass transition temperature and excellent low thermal expansion, copper foil adhesiveness and heat resistance, and to provide a laminate and printed circuit board using the same. ! SOLUTION: Provided is a prepreg obtained by impregnating thermosetting resin composition containing: a compatibility-imparted resin (A) obtained by subjecting a compound (a) having hydroxyl group and epoxy group in the molecular structure, obtained by etherification-reacting a siloxane resin (a1) having phenolic hydroxyl group at the terminal and a compound (a2) having at least 2 epoxy groups in one molecule, and a compound (b) having at least 2 cyanate groups in one molecule, to imino-carbonation reaction and triazine cyclization reaction in an organic solvent, and having imino-carbonate structure and triazine structure whose reaction conversion of (b) component is 30 to 70 mole%; and a fused silica (B) that is surface treated with trimethoxy silane compound, into org |
