APPARATUS FOR CUTTING SUBSTRATE

摘要

Disclosed is an apparatus for cutting a substrate capable of removing dust generated in a substrate, and lowering a temperature elevated by a laser when the substrate is processed, by locally injecting air into a part where a laser is radiated in the substrate. According to an embodiment of the present invention, the apparatus for cutting a substrate comprises: a stage unit on which a substrate is placed; a laser irradiation unit spaced apart from the stage unit, and radiating a laser toward the substrate to process the substrate placed on the stage unit; an air supply unit prepared to supply air toward the substrate heated by the laser irradiation unit, and combined with the stage unit; and an air concentration unit connected with the air supply unit to inject air supplied from the air supply unit into the heated part of the substrate.