| 摘要 |
<p>A first and second release liner are disposed along a sealing sheet which is at least as large as the shape of a semiconductor substrate, and a pressing member provided inside a vacuum chamber holds the surface of the second release liner of the sealing sheet. The first release liner is released, the semiconductor substrate is placed on a holding table having an embedded heater, and the semiconductor substrate and sealing sheet are arranged oppositely. After the vacuum chamber is depressurized to a vacuum state, while the heater heats the sealing sheet in the vacuum chamber, the sealing sheet is pressed by the pressing member and adhered to the semiconductor substrate.</p> |
