COMPOSITION FOR UNDERFILL AND METHOD FOR MOUNTING ELECTRONIC DEVICE

摘要

The present invention relates to a composition for underfill, including an epoxy resin, acid anhydride hardening agents and imidazole-based hardening catalysts, wherein 30-60 parts by weight of the acid anhydride hardening agent, with respect to 100 parts by weight of the epoxy resin, is included in the composition, and 0.6-0.8 parts by weight of the imidazole-based hardening catalyst, with respect to 100 parts by weight of the epoxy resin, is included in the composition. The composition for underfill according to the present invention is allowed to improve adhesive strength between a semiconductor chip and a substrate, when electronic devices like semiconductor chips are mounted on substrates in a flip chip bonding manner, and is hardened right after reflow process, thereby minimizing void between the semiconductor chip and the substrate, and being used as a useful material in flip chip packaging fields.