| 发明名称 |
CAPACITOR EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF |
| 摘要 |
A capacitor embedded substrate and a manufacturing method thereof are disclosed. The capacitor embedded substrate in accordance with an embodiment of the present invention includes: a ceramic layer having a first circuit included therein; a receiving grooved formed on one surface of the ceramic layer; a capacitor being inserted in the receiving groove; a polymer layer being laminated on the ceramic layer in such a way that the capacitor is embedded in the receiving groove and comprising a second circuit electrically connected with the first circuit; and a via electrode being connected with the capacitor by penetrating the polymer layer. |
| 申请公布号 |
US2015173196(A1) |
申请公布日期 |
2015.06.18 |
| 申请号 |
US201414334492 |
申请日期 |
2014.07.17 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
CHOI Yong-Seok;CHUNG Doo-Yun;OH Kwang-Jae;LEE Dae-Hyeong |
| 分类号 |
H05K1/18;H05K13/00;H05K1/11;H01G4/12;H05K1/03 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A capacitor embedded substrate comprising:
a ceramic layer having a first circuit included therein; a receiving grooved formed on one surface of the ceramic layer; a capacitor being inserted in the receiving groove; a polymer layer being laminated on the ceramic layer in such a way that the capacitor is embedded in the receiving groove and comprising a second circuit electrically connected with the first circuit; and a via electrode being connected with the capacitor by penetrating the polymer layer. |
| 地址 |
Suwon-Si KR |
