LOW COST HYBRID HIGH DENSITY PACKAGE

摘要

A microelectronic assembly includes a substrate, a first and second microelectronic elements, a lead finger, electrical connections extending between contacts of the second microelectronic element and the lead fingers, and an encapsulant overlying at least portions of the first and second microelectronic elements, lead finger and electrical connections. The substrate has contacts at a first surface and terminals at an opposed second surface that are electrically connected with the substrate contacts. The first microelectronic element has contacts exposed at its front face. The front face of the first microelectronic element is joined to the substrate contacts. The second microelectronic element overlies the first microelectronic element and has contacts at a front face facing away from the substrate. The lead frame has lead fingers, wherein the second surface of the substrate and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly.

主权项

1. A microelectronic assembly, comprising:
a substrate having first and second opposed surfaces, substrate contacts at the first surface, and terminals at the second surface electrically connected with the substrate contacts; a first microelectronic element having contacts at a front face thereof facing the substrate contacts and joined thereto; a second microelectronic element overlying the first microelectronic element and having contacts at a front face facing away from the substrate; a lead frame having lead fingers, wherein the second surface and the lead fingers define a common interface for electrical interconnection to a component external to the microelectronic assembly; electrical connections extending between the contacts of the second microelectronic element and the lead fingers; and an encapsulant overlying the electrical connections, the first and second microelectronic elements, the substrate and at least portions of the lead fingers.