| 发明名称 |
MEMS DEVICE AND MANUFACTURING METHOD OF THE SAME |
| 摘要 |
According to one embodiment, a MEMS device is disclosed. The device includes a substrate, a MEMS element provided on the substrate, a first film having a plurality of first through holes. The first film and the substrate form a cavity containing the MEMS element. The device further includes a second film provided on the first film, and including a second through hole communicating with a first through hole of the plurality of first through holes, and a third film provided on the second film, and closing the first through hole communicating with the second through hole. |
| 申请公布号 |
US2015170997(A1) |
申请公布日期 |
2015.06.18 |
| 申请号 |
US201414476452 |
申请日期 |
2014.09.03 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
NAKAMURA Naofumi |
| 分类号 |
H01L23/48;B81B3/00;B81C1/00;H01L21/768 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A MEMS device comprising:
a substrate; a MEMS element provided on the substrate; a first film comprising a plurality of first through holes, the first film and the substrate forming a cavity containing the MEMS element; a second film provided on the first film, and comprising a second through hole communicating with a first through hole of the plurality of first through holes; and a third film provided on the second film, and closing the first through hole communicating with the second through hole. |
| 地址 |
Tokyo JP |
