| 发明名称 |
SYSTEMS AND METHODS FOR INTELLIGENT DISPATCHING FOR WAFER PROCESSING |
| 摘要 |
Systems and methods are provided for ion implantation. For example, ion implantation is performed using a first ion implant tool. At least one condition parameter associated with the first ion implant tool is dynamically obtained. Whether the first ion implant tool is in a first condition is determined based on the at least one condition parameter. Ion implantation is performed using a second ion implant tool based on the determination. |
| 申请公布号 |
US2015170917(A1) |
申请公布日期 |
2015.06.18 |
| 申请号 |
US201314132362 |
申请日期 |
2013.12.18 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company Limited |
发明人 |
HO KUO-YUAN;CHEN LI-JEN;KAO CHIH-CHENG;ZENG SHIH-TING;LIN YI-HSIUNG |
| 分类号 |
H01L21/265;H01L21/66 |
主分类号 |
H01L21/265 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method comprising:
performing ion implantation using a first ion implant tool; dynamically obtaining at least one condition parameter associated with the first ion implant tool; determining whether the first ion implant tool is in a first condition based on the at least one condition parameter; and performing ion implantation using a second ion implant tool based on the determination. |
| 地址 |
Hsinchu TW |
