LASER PROCESSING OF SLOTS AND HOLES

摘要

The present invention relates to a process for cutting and separating interior contours in thin substrates of transparent materials, in particular glass. The method involves the utilization of an ultra-short pulse laser to form perforation or holes in the substrate, that may be followed by use of a CO2 laser beam to promote full separation about the perforated line.

主权项

1. A method of laser drilling a material comprising:
focusing a pulsed laser beam into a laser beam focal line, viewed along the beam propagation direction; directing the laser beam focal line into the material at a first location, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a damage track along the laser beam focal line within the material; translating the material and the pulsed laser beam relative to each other starting from the first location along a first closed contour, thereby laser drilling a plurality of holes along the first closed contour within the material; and directing a focused carbon dioxide (CO2) laser into the material around a second closed contour contained within the first closed contour to facilitate removal of an inner plug of the material along the first closed contour.