MOLD-RELEASE POLYIMIDE FILM, LAMINATED BOARD HAVING MOLD-RELEASE POLYIMIDE FILM HAVING ADHESIVE LAYER, LAMINATED BOARD, MONOLAYER OR MULTILAYER WIRING BOARD HAVING MOLD-RELEASE POLYIMIDE FILM HAVING ADHESIVE LAYER, AND METHOD FOR MANUFACTURING MULTILAYER WIRING BOARD

摘要

Provided is a mold-release polyimide film that serves as a material that can be used to manufacture a monolayer or multilayer wiring board having good planarity, that can obtain an insulating layer having good surface roughness in a semi-additive process, and that does not require etching after thermal pressing. Specifically provided is a mold-release polyimide film having a mold-release layer formed on at least one surface of a polyimide film, said mold-release layer containing an alkyd resin and an amino resin. Also provided is a method for manufacturing a multilayer wiring board, said method comprising: a step for manufacturing a monolayer or multilayer wiring board having a mold-release polyimide film having an adhesive layer by laminating a mold-release polyimide film, which has an adhesive layer on the surface of the mold-release layer to which the polyimide film is not provided, onto a monolayer or multilayer wiring board; a step for removing the mold-release polyimide film from the monolayer or multilayer wiring board having a mold-release polyimide film having an adhesive layer; and a step for performing circuit processing.