发明名称 |
TREATED SURFACE COPPER FOIL, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND PRINTED WIRING BOARD MANUFACTURING METHOD |
摘要 |
The present invention provides a treated surface copper foil, which adheres favorably to resin and achieves excellent visibility when observed through the resin. Provided is a treated surface copper foil in which respective surface treatments have been performed on the two surfaces, wherein the color difference (∆E*ab) based on JIS Z8730 of the through-polyimide surface of a copper-clad laminate, configured by laminating treated surface copper foil on a polyimide with a ∆B(PI) before bonding to the copper foil of 50 to 65, is at least 50. When the copper foil is photographed with a CCD camera through the polyimide, which has been laminated from the surface on which surface treatment has been performed, ∆B (∆B = Bt - Bb) in the observation point-brightness graph is at least 40. The ten-point mean roughness (Rz) of TD of the other surface of the treated surface copper foil measured with a laser microscope in which the wavelength of the laser light is 405 nm is at least 0.35 µm. |
申请公布号 |
WO2015087942(A1) |
申请公布日期 |
2015.06.18 |
申请号 |
WO2014JP82766 |
申请日期 |
2014.12.10 |
申请人 |
JX NIPPON MINING & METALS CORPORATION |
发明人 |
ARAI,HIDETA;MIKI,ATSUSHI;ARAI,KOHSUKE;NAKAMURO,KAICHIRO |
分类号 |
C25D7/06;B32B15/08;H05K3/38 |
主分类号 |
C25D7/06 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|