Flip-chip Solar Cell Chip and Fabrication Method Thereof

摘要

A flip-chip solar cell chip includes a bonding transfer substrate; a metal bonding layer; a flip-chip solar cell epitaxial layer that bonds with the bonding transfer substrate with the metal bonding layer; the flip-chip solar cell epitaxial layer and the metal bonding layer are divided into two or more portions; the surface of the flip-chip solar cell epitaxial layer has a front electrode; and the metal bonding layer is connected with the ends of the front electrode to form a series connection of the divided epitaxial layer. Advantageously, the division of the solar cell epitaxial layer into a plurality of completely-separated portions greatly reduces photo currents and power loss of cell chip series resistance while realizing multiplied increase of output voltage, thereby improving photoelectric conversion efficiency. The use of metal bonding layer as the back electrode realizes extremely low resistance loss of the back electrode.

主权项

1. A flip-chip solar cell chip, comprising:
an insulating transfer substrate; a metal bonding layer; and a flip-chip solar cell epitaxial layer,
wherein:the flip-chip solar cell epitaxial layer bonds with the transfer substrate with the metal bonding layer; the flip-chip solar cell epitaxial layer and the metal bonding layer are divided into a plurality of units, each unit having an “L” shape and comprising a body area and an interconnect area, wherein the interconnect area comprises an end protrusion portion, wherein a starting side of each unit is at the body area and an ending side is at the interconnect area; a surface of the divided flip-chip solar cell epitaxial layer has a front electrode; and the metal bonding layer is coupled with ends of the front electrode to form a series connection of the divided flip-chip solar cell epitaxial layer.