| 发明名称 |
Compound Structure and Method for Forming a Compound Structure |
| 摘要 |
A compound structure including a carrier wafer and at least one semiconductor piece bonded onto the carrier wafer by a bonding material obtained by a ceramic-forming polymer precursor. |
| 申请公布号 |
US2015171045(A1) |
申请公布日期 |
2015.06.18 |
| 申请号 |
US201314105414 |
申请日期 |
2013.12.13 |
| 申请人 |
Infineon Technologies AG |
发明人 |
Berger Rudolf;Ruhl Guenther;Lehnert Wolfgang;Rupp Roland |
| 分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A compound structure comprising:
a carrier wafer; and at least one semiconductor piece bonded onto the carrier wafer by a bonding material obtained by a ceramic-forming polymer precursor. |
| 地址 |
Neubiberg DE |
