| 摘要 |
PROBLEM TO BE SOLVED: To provide a polyimide film that exhibits a low dielectric constant, low thermal expansion, ability to form a multilayered structure, and good heat and chemical resistance.SOLUTION: A multilayered polyimide film 1 includes a first polyimide layer 11 containing fluorine-containing polymer particles and having a first surface S1 and a second surface S2, and a second polyimide layer 12 and a third polyimide layer 13 respectively disposed on the first surface S1 and the second surface S2. The second and the third polyimide layers 12 and 13 contain organic silicon oxygen compound particles. The multilayered polyimide film 1 has a coefficient of thermal expansion (CTE) between 13 and 30 ppm/°C. |
