| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulation resin sheet that is used for forming an insulating layer of a multilayer printed wiring board, and comprises prepreg, where, sheet-like fiber base material included in the prepreg is not exposed on the surface of the insulating layer.SOLUTION: An insulation resin sheet has a cured product layer of a thermosetting resin composition on one face of prepreg. Preferably, the insulation resin sheet further has, on the cured product layer, a support layer. The insulation resin sheet of such a structure can be obtained by sticking a cured product sheet with the cured product layer of the thermosetting resin composition formed on a support to the one face of prepreg. |
