| 发明名称 |
POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME |
| 摘要 |
Disclosed herein are a power module package and a method for manufacturing the same. According to a preferred embodiment of the present invention, a power module package includes: a metal substrate having an insulating layer and a circuit pattern formed on one surface thereof; at least one first electronic device mounted on the circuit pattern; a lead frame disposed around the metal substrate; a molding area enclosing the metal substrate, the first electronic device, and a portion of the lead frame; and a heat sink including a connection part contacting the insulating layer and a body part disposed on a surface opposite to the first electronic device and including one surface bonded to the connection part and the other surface exposed from an upper surface of the molding area. |
| 申请公布号 |
US2015173246(A1) |
申请公布日期 |
2015.06.18 |
| 申请号 |
US201414317469 |
申请日期 |
2014.06.27 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
Jang Bum Sik;Song Sung Min |
| 分类号 |
H05K7/20;B29C65/70;H05K7/02 |
主分类号 |
H05K7/20 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A power module package, comprising:
a metal substrate having an insulating layer and a circuit pattern formed on one surface thereof; at least one first electronic device mounted on the circuit pattern; a lead frame disposed around the metal substrate; a molding area enclosing the metal substrate, the first electronic device, and a portion of the lead frame; and a heat sink including a connection part contacting the insulating layer and a body part disposed on a surface opposite to the first electronic device and including one surface bonded to the connection part and the other surface exposed from an upper surface of the molding area. |
| 地址 |
Suwon-Si KR |
