| 发明名称 |
FILM FORMING APPARATUS |
| 摘要 |
A film forming apparatus includes a susceptor having a first portion that holds a wafer on a top surface of the susceptor and a second portion connected to the first portion, a gas supply section that supplies a material gas to a location above the susceptor, a first heater that heats the first portion, a second heater that heats the second portion, and a temperature control apparatus that controls temperatures of the first heater and the second heater. The temperature control apparatus keeps the temperature above the susceptor constant by increasing the temperature of the second heater while maintaining the temperature of the first heater during formation of a film on the wafer. |
| 申请公布号 |
US2015167169(A1) |
申请公布日期 |
2015.06.18 |
| 申请号 |
US201414476788 |
申请日期 |
2014.09.04 |
| 申请人 |
Mitsubishi Electric Corporation |
发明人 |
Takada Makoto;Nagira Takashi |
| 分类号 |
C23C16/46;C23C16/458;C23C16/455;C23C16/52 |
主分类号 |
C23C16/46 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A film forming apparatus comprising:
a susceptor comprising a first portion that holds a wafer on a top surface of the susceptor and a second portion connected to the first portion; a gas supply section that supplies a material gas to a location above the susceptor; a first heater that heats the first portion; a second heater that heats the second portion; and a temperature control apparatus that controls temperatures of the first heater and the second heater, wherein the temperature control apparatus keeps the temperature above the susceptor constant by increasing the temperature of the second heater while maintaining the temperature of the first heater during information of a film on the wafer. |
| 地址 |
Tokyo JP |
