| 摘要 |
PROBLEM TO BE SOLVED: To provide an improved forming method of an insulating tape from a silicone composition while reducing a burden of a solvent, and further to provide an improved forming method of an insulating layer on a substrate.SOLUTION: A forming method of a curable adhesive tape comprising a partially cured reaction intermediary comprises applying a silicone composition substantially free from solvent and including an alkenyl siloxane, a hydrogen siloxane, a metallic hydrosilylation catalyst, and an initiator onto a flexible substrate, and heating the silicone composition to a first desired temperature of 118-125°C for a first period of time of 120-450 sec. A forming method of an insulating layer on a conductive substrate utilizes the same steps as the forming method of the curable adhesive tape and further comprises a step of disposing the flexible substrate on the conductive substrate and a step of forming the insulating layer by heating the partially cured reaction intermediary to a second desired temperature for a second period of time. |
