发明名称 CLEANING COMPOSITION FOR REMOVING ORGANIC MATERIAL AND METHOD OF FORMING SEMICONDUCTOR DEVICE USING THE COMPOSITION
摘要 Provided are a cleaning composition for removing an organic material remaining on an organic layer and a method of forming a semiconductor device using the composition. The cleaning composition includes 0.01-5 wt %.hydroxide based on a total weight of the cleaning composition and deionized water.
申请公布号 US2015166942(A1) 申请公布日期 2015.06.18
申请号 US201414466338 申请日期 2014.08.22
申请人 KANG Ingoo;KANG Dong-Min;KIM Sangkyun;KIM Yun-Jeong;CHOI Jungsik;HONG Young Taek 发明人 KANG Ingoo;KANG Dong-Min;KIM Sangkyun;KIM Yun-Jeong;CHOI Jungsik;HONG Young Taek
分类号 C11D11/00;C11D7/06;H01L21/02;H01L21/311;H01L21/3105;C11D7/32;C11D7/50 主分类号 C11D11/00
代理机构 代理人
主权项 1. A cleaning composition for removing an organic residue on an organic layer, the cleaning composition comprising: 0.01 to 5 wt. % hydroxide based on a total weight of the cleaning composition; and deionized water.
地址 Yongin-si KR