发明名称 TREATED SURFACE COPPER FOIL, COPPER-CLAD LAMINATE, PRINTED WIRING BOARD, ELECTRONIC DEVICE, AND PRINTED WIRING BOARD MANUFACTURING METHOD
摘要 Provided is a treated surface copper foil with excellent resin transparency after the copper foil has been removed by etching. For the treated surface copper foil, respective surface treatments have been performed on the two surfaces. After being bonded from one surface on both surfaces of a polyimide resin substrate, the copper foil on both surfaces is removed by etching. In the observation point-brightness graph obtained when a printed object on which a line-shaped mark has been printed is photographed, Sv as defined by equation (1) is at least 3.5. Sv = (∆B × 0.1)/(t1-t2) (1) The ten-point mean roughness (Rz) of TD of the other surface of the treated surface copper foil measured with a laser microscope in which the wavelength of the laser light is 405 nm is at least 0.35 µm.
申请公布号 WO2015087941(A1) 申请公布日期 2015.06.18
申请号 WO2014JP82765 申请日期 2014.12.10
申请人 JX NIPPON MINING & METALS CORPORATION 发明人 ARAI,HIDETA;MIKI,ATSUSHI;ARAI,KOHSUKE;NAKAMURO,KAICHIRO
分类号 C25D7/06;B32B15/08;H05K3/38 主分类号 C25D7/06
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