SUBMOUNT FOR LED DEVICE PACKAGE

摘要

A light emitting diode (LED) assembly may include an LED semiconductor attached to a first surface of a submount made of optically transparent material. The submount may redirect back side light emitted by the LED semiconductor light away from the LED semiconductor to increase recovery of back side light. The submount may be used with an external bulk reflecting element. The submount may itself include a reflective coating at a second surface opposite from the first surface and be mounted on a reflecting substrate. The submount may include a phosphor forming the first surface or the second surface. The first surface or the second surface may be a textured surface. An array of LED semiconductors may be mounted to the submount. The array of LED semiconductors may be disposed on the submount in an arrangement that optimizes total light output of the LED assembly.

主权项

1. A method of assembling a light emitting diode (LED) assembly, the method comprising:
attaching an LED semiconductor to a first surface of a submount, wherein the LED semiconductor includes a p-type semiconductor and an n-type semiconductor forming a p-n junction defining an active region where light is generated, and wherein the submount includes an optically transparent material; and wherein attaching the LED semiconductor to the first surface includes: providing the light generated at the active region with an optical path to the submount at the first surface.