| 发明名称 |
SENSOR PACKAGE AND MANUFACTURING METHOD |
| 摘要 |
A sensor package comprises a sensor chip bonded to an intermediate carrier, with the sensor element over an opening in the carrier. The package is for soldering to a board, during which the intermediate carrier protects the sensor part of the sensor chip. |
| 申请公布号 |
US2015171042(A1) |
申请公布日期 |
2015.06.18 |
| 申请号 |
US201414566309 |
申请日期 |
2014.12.10 |
| 申请人 |
NXP B.V. |
发明人 |
Bouman Hendrik;Daamen Roel;Tak Coenraad |
| 分类号 |
H01L23/00;H01L21/56;H01L23/31 |
主分类号 |
H01L23/00 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A sensor package, comprising:
an integrated circuit chip which carries at least one sensor element on a first surface; an intermediate carrier having a first surface to which the first surface of the integrated circuit chip is bonded by an adhesive, wherein the intermediate carrier has an opening beneath the sensor element; and solder bond pads on a second surface of the intermediate carrier opposite the fist surface. |
| 地址 |
Eindhoven NL |
