发明名称 DEVICE AND METHOD FOR ALIGNING SUBSTRATES
摘要 A device for aligning and bringing a large-area substrate into contact with a carrier substrate comprising: a substrate holding means for attaching the substrate; a carrier substrate holding means for attaching the carrier substrate; detection means for detection of a peripheral contour of the substrate attached to the substrate holding means and detection of a peripheral contour of the carrier substrate attached to the carrier substrate holding means relative to a contact plane of the substrate with the carrier substrate; aligning means for aligning the substrate relative to the carrier substrate; and contacting means for bringing the substrate into contact with the carrier substrate.
申请公布号 US2015170950(A1) 申请公布日期 2015.06.18
申请号 US201214406790 申请日期 2012.06.12
申请人 Thallner Erich 发明人 Thallner Erich
分类号 H01L21/68;H01L21/677;H01L21/673 主分类号 H01L21/68
代理机构 代理人
主权项 1. Device for aligning and bringing a large-area substrate into contact with a carrier substrate for the further processing of the substrate, said device comprising: a substrate holding means for attaching the substrate, a carrier substrate holding means for attaching the carrier substrate, detection means for detection of a peripheral contour of the substrate attached to the substrate holding means and detection of a peripheral contour of the carrier substrate attached to the carrier substrate holding means relative to a contact plane of the substrate with the carrier substrate, aligning means for aligning the substrate relative to the carrier substrate, whereby the aligning means are controlled by controlling means based on the peripheral contours detected by the detection means, and contacting means (3) for bringing the substrate, aligned relative to the carrier substrate, into contact with the carrier substrate, wherein the aligning means and the contacting means are designed for continuous alignment until contacting.
地址 St. Florian AT