发明名称 PROCESSING APPARATUS AND PROCESSING METHOD
摘要 <p>A processing apparatus (100) is provided with: a tool (12) for processing a surface (51a) of a workpiece (51); a first linear motion mechanism unit (16) that moves the tool (12) in the first direction along the surface (51a) of the workpiece (51); a second linear motion mechanism unit (20) that moves the tool (12) in the second direction orthogonal to the first direction such that a distance between a leading end (12p) of the tool (12) and the surface (51a) of the workpiece (51) changes; a distance measuring unit (24) for specifying the distance between the leading end (12p) of the tool (12) and the surface (51a) of the workpiece (51); and a moving mechanism unit (28), which has the tool (12) and the distance measuring unit (24) mounted thereon, and which alternately moves the tool (12) and the distance measuring unit (24) to a specified position on a workpiece surface. With such configuration, the processing apparatus that achieves excellent cost performance and highly accurate processing of the workpiece surface is provided.</p>
申请公布号 WO2015087411(A1) 申请公布日期 2015.06.18
申请号 WO2013JP83199 申请日期 2013.12.11
申请人 SUMITOMO CHEMICAL COMPANY, LIMITED 发明人 FUJII, TAKASHI
分类号 B23Q17/22;B23Q1/60;B23Q17/20 主分类号 B23Q17/22
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