THERMALLY DECOMPOSABLE FILLING COMPOSITION, SEMICONDUCTOR DEVICE COMPRISING CAVITY FORMED BY USING THE COMPOSITION, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE COMPOSITION

摘要

PROBLEM TO BE SOLVED: To provide a filling composition capable of forming a sacrificial region formed of a sacrificial material completely decomposed and vaporized at a desired temperature, and to provide a method of manufacturing a semiconductor device by using the same. ! SOLUTION: A filling composition contains: a polymer having a repetition unit represented by the following formula (1); and a solvent that can solve the polymer. Also provided is a method of manufacturing a semiconductor device by using the filling composition as a sacrificial material. ! COPYRIGHT: (C)2015,JPO&INPIT