MULTI-LAYER PRINTED CIRCUIT BOARD

摘要

A multi-layer printed circuit board includes a first layer, a second layer, at least one third layer, a conductive via hole, and a capacitor electronically coupled to the conductive via hole. The at least one third layer is sandwiched between the first and second layers. The conductive via hole is defined through the first, second and third layers, and having a parasitic inductance. The capacitor and the parasitic inductance of the conductive via hole cooperatively form a low-pass filter that is configured to filter noise signal induced by conductive via hole due to the parasitic inductance.

主权项

1. A multi-layer printed circuit board comprising:
a first layer; a second layer; at least one third layer between the first and second layers; a conductive via hole defined through the first, second and third layers, and having a parasitic inductance; a filtering capacitor electronically coupled between the conductive via hole and ground, the filtering capacitor and the parasitic inductance of the conductive via hole cooperatively forming a low-pass filter that is configured to filter noise signal induced by the conductive via hole due to the parasitic inductance.