发明名称 Film Formation Apparatus and Method for Forming a Film
摘要 An apparatus for forming a film having high uniformity in its film thickness distribution is provided. An evaporation source is used in which an evaporation cell, or a plurality of evaporation cells, having a longitudinal direction is formed, and by moving the evaporation source in a direction perpendicular to the longitudinal direction of the evaporation source, a thin film is deposited on a substrate. By making the evaporation source longer, the uniformity of the film thickness distribution in the longitudinal direction is increased. The evaporation source is moved, film formation is performed over the entire substrate, and therefore the uniformity of the film thickness distribution over the entire substrate can be increased.
申请公布号 US2015171329(A1) 申请公布日期 2015.06.18
申请号 US201514633750 申请日期 2015.02.27
申请人 Semiconductor Energy Laboratory Co., Ltd. 发明人 Yamazaki Shunpei;Fukunaga Takeshi
分类号 H01L51/00;C23C14/24 主分类号 H01L51/00
代理机构 代理人
主权项 1. (canceled)
地址 Kanagawa-ken JP