发明名称 METHOD FOR PROVIDING ELECTRICAL CONNECTIONS TO SPACED CONDUCTIVE LINES
摘要 An integrated circuit and a method of formation provide a contact area formed at an angled end of at least one linearly extending conductive line. In an embodiment, conductive lines with contact landing pads are formed by patterning lines in a mask material, cutting at least one of the material lines to form an angle relative to the extending direction of the material lines, forming extensions from the angled end faces of the mask material, and patterning an underlying conductor by etching using said material lines and extension as a mask. In another embodiment, at least one conductive line is cut at an angle relative to the extending direction of the conductive line to produce an angled end face, and an electrical contact landing pad is formed in contact with the angled end face.
申请公布号 US2015171090(A1) 申请公布日期 2015.06.18
申请号 US201514633189 申请日期 2015.02.27
申请人 MICRON TECHNOLOGY, INC. 发明人 Sandhu Gurtej;Sills Scott
分类号 H01L27/108;H01L21/768;H01L21/28 主分类号 H01L27/108
代理机构 代理人
主权项 1. A method of forming an integrated circuit structure on a support structure, the method comprising: forming a plurality of linearly extending material stack lines as part of the integrated circuit structure each comprising a polysilicon material, a metal silicide material, and an oxide top material, the material stack lines each having an angled end face at a different location along the linearly extending direction of the material stack lines; and forming a contact landing pad in contact with each angled end face.
地址 Boise ID US