| 发明名称 |
SUBSTRATE SUPPORT APPARATUS HAVING REDUCED SUBSTRATE PARTICLE GENERATION |
| 摘要 |
Embodiments of apparatus for supporting a substrate are disclosed herein. In some embodiments, an apparatus for supporting a substrate includes: a support surface; and a plurality of substrate contact elements protruding from the support surface, wherein the plurality of substrate contact elements are formed of a material having a hardness less than or equal to a hardness of silicon, having a low adhesion, having a coefficient of static friction large enough to prevent sliding, having a surface roughness less than or equal to 10 Ra, and that is electrically conductive. |
| 申请公布号 |
US2015170954(A1) |
申请公布日期 |
2015.06.18 |
| 申请号 |
US201414554945 |
申请日期 |
2014.11.26 |
| 申请人 |
APPLIED MATERIALS, INC. |
发明人 |
AGARWAL PULKIT;SUH SONG-MOON;MORI GLEN;SANSONI STEVEN V. |
| 分类号 |
H01L21/687;B25J11/00;B25J15/00 |
主分类号 |
H01L21/687 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An apparatus for supporting a substrate, comprising:
a support surface; and a plurality of substrate contact elements protruding from the support surface, wherein the plurality of substrate contact elements are formed of a material having a hardness less than or equal to a hardness of silicon, having a low adhesion, having a coefficient of static friction large enough to prevent sliding, having a surface roughness less than or equal to 10 Ra, and that is electrically conductive. |
| 地址 |
Santa Clara CA US |
