发明名称 SEMICONDUCTOR SYSTEM ASSEMBLIES AND METHODS OF OPERATION
摘要 An exemplary semiconductor processing system may include a high-frequency electrical source that has an outlet plug. The system may include a processing chamber having a top plate, and an inlet assembly coupled with the top plate. The inlet assembly may include an electrode defining an aperture at a first end and configured to receive the outlet plug. The aperture may be characterized at the first end by a first diameter, and a second end of the aperture opposite the first end may be characterized by a second diameter less than the first diameter. The inlet assembly may further include an inlet insulator coupled with the top plate and configured to electrically insulate the top plate from the electrode.
申请公布号 US2015170879(A1) 申请公布日期 2015.06.18
申请号 US201314108683 申请日期 2013.12.17
申请人 Applied Materials, Inc. 发明人 Nguyen Andrew;Ramaswamy Kartik;Nemani Srinivas;Howard Bradley;Vishwanath Yogananda Sarode
分类号 H01J37/32 主分类号 H01J37/32
代理机构 代理人
主权项 1. A semiconductor processing system comprising: a high-frequency electrical source including an outlet plug; a processing chamber having a top plate; and an inlet assembly coupled with the top plate and comprising: an electrode defining an aperture at a first end and configured to receive the outlet plug, wherein the aperture is characterized at the first end by a first diameter, and wherein a second end of the aperture opposite the first end is characterized by a second diameter less than the first diameter, andan inlet insulator coupled with the top plate and configured to electrically insulate the top plate from the electrode.
地址 Santa Clara CA US