发明名称 CARRIER HEAD HAVING ABRASIVE STRUCTURE ON RETAINER RING
摘要 A carrier head includes a housing configured to enclose a wafer and a retainer ring attached to the housing. The retainer ring includes a body and an abrasive structure. The body includes an inner periphery configured to surround the wafer, an outer periphery, and a surface connecting the inner periphery and the outer periphery. The abrasive structure is attached to the surface of the body.
申请公布号 US2015165587(A1) 申请公布日期 2015.06.18
申请号 US201314105232 申请日期 2013.12.13
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 LIN Chang-Sheng
分类号 B24B37/32;B24B53/017 主分类号 B24B37/32
代理机构 代理人
主权项 1. A carrier head comprising: a housing configured to enclose a wafer; and a retainer ring attached to the housing, the retainer ring comprising: a body, comprising: an inner periphery configured to surround the wafer;an outer periphery; anda surface connecting the inner periphery and the outer periphery; andan abrasive structure attached to the surface of the body.
地址 Hsinchu TW