发明名称 |
CARRIER HEAD HAVING ABRASIVE STRUCTURE ON RETAINER RING |
摘要 |
A carrier head includes a housing configured to enclose a wafer and a retainer ring attached to the housing. The retainer ring includes a body and an abrasive structure. The body includes an inner periphery configured to surround the wafer, an outer periphery, and a surface connecting the inner periphery and the outer periphery. The abrasive structure is attached to the surface of the body. |
申请公布号 |
US2015165587(A1) |
申请公布日期 |
2015.06.18 |
申请号 |
US201314105232 |
申请日期 |
2013.12.13 |
申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
LIN Chang-Sheng |
分类号 |
B24B37/32;B24B53/017 |
主分类号 |
B24B37/32 |
代理机构 |
|
代理人 |
|
主权项 |
1. A carrier head comprising:
a housing configured to enclose a wafer; and a retainer ring attached to the housing, the retainer ring comprising:
a body, comprising:
an inner periphery configured to surround the wafer;an outer periphery; anda surface connecting the inner periphery and the outer periphery; andan abrasive structure attached to the surface of the body. |
地址 |
Hsinchu TW |