APPARATUS AND METHOD FOR PROCESSING SUBSTRATE

摘要

The present invention relates to an apparatus and method for processing a surface of a substrate by subjecting the surface to successive surface reactions of a first and second precursor. The apparatus includes a nozzle head having two or more precursor nozzles and a moving mechanism for moving the nozzle head in non-linear oscillating movement in a first and second movement direction between a first extreme position and a second extreme position via a centre position. The moving mechanism includes first driving means for accelerating the nozzle head in the first moving direction and decelerating the nozzle head in the second moving direction and second driving means for accelerating the nozzle head in the second moving direction and decelerating the nozzle head in the first moving direction.

主权项

1. An apparatus for processing a surface of a substrate by subjecting the surface of a substrate to successive surface reactions of at least a first precursor and a second precursor, the apparatus comprising:
at least one nozzle head having two or more precursor nozzles for subjecting the surface of the substrate to at least the first and second precursors; and a moving mechanism for moving the nozzle head in non-linear oscillating movement between a first extreme position and a second extreme position via a centre position, wherein the moving mechanism comprises first driving means and second driving means connected to the nozzle head for controlling in co-operation the non-linear oscillating movement between the first and second extreme positions.