ENCAPSULANT COMPOSITION, ENCAPSULANT, AND ELECTRONIC DEVICE

摘要

Provided are: an encapsulant composition containing at least one type of first siloxane compound having a silicon-bonded alkenyl group (Si-Vi) and a carbonsilane compound having silicon-bonded hydrogen (Si-H) as a curing agent; an encapsulant obtained by curing the encapsulant composition; and an electronic device including the encapsulant.