| 摘要 |
<p>Introduced is a thermoelectric module. It includes an upper panel and a lower panel which perform thermal conduction and are vertically separated from each other; semiconductor devices arranged between the upper panel and the lower panel; an upper electrode and a lower electrode which are respectively prepared on an inner surface which faces the upper and the lower panel, and forms a series circuit; and a PTC device interposed in the series circuit.</p> |
