| 发明名称 |
PLATING APPARATUS, PLATING METHOD, AND STORAGE MEDIUM |
| 摘要 |
A plating method can improve uniformity in thickness of a plating layer formed on an inner surface of a recess. The plating method includes a loading process of loading the substrate in which the recess is formed into a casing; and a plating process of supplying a plating liquid to the substrate and forming a plating layer having a specific function on an inner surface of the recess. In the plating process, after supplying the plating liquid to the substrate and filling the plating liquid into the recess, a plating liquid having a higher temperature than a temperature of the plating liquid is supplied to the substrate. |
| 申请公布号 |
US2015167174(A1) |
申请公布日期 |
2015.06.18 |
| 申请号 |
US201314404174 |
申请日期 |
2013.05.27 |
| 申请人 |
Tokyo Electron Limited |
发明人 |
Mizutani Nobutaka;Tanaka Takashi;Iwashita Mitsuaki |
| 分类号 |
C23C18/18;C23C18/16 |
主分类号 |
C23C18/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A plating method of performing a plating process to a recess formed in a substrate, the plating method comprising:
a loading process of loading the substrate in which the recess is formed into a casing; and a plating process of supplying a plating liquid to the substrate and forming a plating layer having a specific function on an inner surface of the recess, wherein, in the plating process, after supplying the plating liquid to the substrate and filling the plating liquid into the recess, a plating liquid having a higher temperature than a temperature of the plating liquid is supplied to the substrate. |
| 地址 |
Tokyo JP |
