| 发明名称 |
SEMICONDUCTOR MANUFACTURING DEVICE AND SEMICONDUCTOR MANUFACTURING METHOD |
| 摘要 |
A semiconductor manufacturing device has an upper cover configured to be arranged above top surface of unshielded semiconductor device which are mounted on a tray placed on a carrier to go through electromagnetic shielding, and a displacement detector configured to detect an abnormality when the upper cover is raised by at least one of the semiconductor device which is brought into contact with a bottom surface of the upper cover. |
| 申请公布号 |
US2015167157(A1) |
申请公布日期 |
2015.06.18 |
| 申请号 |
US201414482489 |
申请日期 |
2014.09.10 |
| 申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
Shibuya Katsunori;Imoto Takashi;Homma Soichi;Watanabe Takeshi;Takano Yuusuke |
| 分类号 |
C23C14/50;C23C14/54;H01L21/66;H01L21/67;H01L21/48;C23C14/34;H01L23/552 |
主分类号 |
C23C14/50 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor manufacturing device comprising:
an upper cover configured to be arranged above top surfaces of unshielded semiconductor device which are mounted on a tray placed on a carrier to go through electromagnetic shielding; and a displacement detector configured to detect an abnormality when the upper cover is raised by at least one of the semiconductor device which is brought into contact with a bottom surface of the upper cover. |
| 地址 |
Minato-ku JP |
