| 摘要 |
[Problem] The purpose of the present invention is to provide an electroless plating method which is capable of reliably forming a wiring pattern by a simple process. [Solution] This electroless plating method is characterized by comprising: a pattern formation step (P11) wherein an ink pattern (11R) is formed on a substrate (11) with use of an ink that contains a specific component; a catalyst application step (P12) wherein a catalyst (52) is applied to a region in which the ink pattern (11R) is formed; a catalyst inactivation step (P13) wherein the catalyst (52) applied onto the ink pattern (11R) is inactivated by means of the component contained in the ink by heating the substrate (11); and a wiring pattern formation step (P15) wherein an electroless plating film is formed on portions other than the ink pattern (11R) by immersing the substrate (11) in an electroless plating solution. |
