发明名称 INTEGRATED WIRE BONDER AND 3D MEASUREMENT SYSTEM WITH DEFECT REJECTION
摘要 <p>An apparatus comprises a wire bonder system including a wire bonding device, a measuring device and a rejection device. The wire bonding device is configured to attach wire bond type electrical interconnect to an electronic assembly. A wire bond is formed between a first semiconductor device and a second electronic device to form at least a portion of the electronic assembly. The measuring device is configured to perform a three dimensional measurement associated with a wire bond, and the rejection device is configured to identify an electronic assembly for rejection according to the three dimensional wire bond measurement.</p>
申请公布号 WO2015088658(A2) 申请公布日期 2015.06.18
申请号 WO2014US62172 申请日期 2014.10.24
申请人 FAIRCHILD SEMICONDUCTOR CORPORATION 发明人 KELLER, DAREN W.
分类号 H01L21/67 主分类号 H01L21/67
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