发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To improve connection reliability between an upper substrate and a lower substrate. ! SOLUTION: The printed wiring board includes an inside metal post and an outside metal post. The inside metal post is shorter than the outside metal post. ! COPYRIGHT: (C)2015,JPO&INPIT
申请公布号 JP2015111608(A) 申请公布日期 2015.06.18
申请号 JP20130252788 申请日期 2013.12.06
申请人 IBIDEN CO LTD 发明人 ADACHI TAKEMA ; NAKAMURA WATARU ; KAIDA YUZO ; OZAKI ATSUSHI
分类号 H01L23/12;H01L23/28;H01L25/065;H01L25/07;H01L25/18 主分类号 H01L23/12
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