| 摘要 |
PROBLEM TO BE SOLVED: To enable the arrangement of various types of vias on a probe card wiring board so that upper and lower components can be connected with a small number of vias, and enable the reduction in man hours and period required for the arrangement. ! SOLUTION: When the position of a probe, which is connected with a tester interface part via electronic components, does not belong to a through via non-arrangeable area defined by the positions of the electronic components and the clearance between pads, a wiring board via arrangement determination device determines to arrange through vias. The wiring board via arrangement determination device determines the arrangement of relay through vias to be provided when the through vias cannot be provided, to a portion where the length of a wiring path becomes short, from a plurality of portion candidates around a lattice point for each of vertical and horizontal predetermined pitches. ! COPYRIGHT: (C)2015,JPO&INPIT |
