ELECTRONIC PACKAGED DEVICE AND MANUFACTURING METHOD THEREOF

摘要

A manufacturing method of electronic packaged device includes the following. A plurality of electronic components is disposed on a substrate carrier. An encapsulating member is disposed on the substrate carrier and covers the electronic components. The substrate carrier is separated from the encapsulating member. A plurality of first trenches is arranged on a first surface of the encapsulating member. Conductive material is disposed onto the first surface and into the first trenches to form a conductive layer. The conductive layer is patterned on the first surface to form a circuit layer. The circuit layer includes at least one grounding pad. A plurality of second trenches is arranged on a second surface of the encapsulating member. At least one shielding structure is formed in the first trenches and the second trenches. An electromagnetic shielding layer is connected to the grounding pad.

主权项

1. An electronic package device manufacturing method, comprising:
configuring a plurality of electronic components on a surface of a substrate carrier; forming an encapsulating member on the surface of the substrate carrier to cover the electronic components; separating the substrate carrier from the encapsulating member; forming a plurality of first trenches and a plurality of first grounding trenches on a first surface of the encapsulating member; disposing conductive material on the first surface of the encapsulating member, in the first trenches, and in the first grounding trenches to form a conductive layer and a plurality of grounding structures; patterning the conductive layer on the first surface to form a circuit layer, wherein the circuit layer includes at least one grounding pad electrically connected to the grounding structures; forming a plurality of second trenches on a second surface of the encapsulating member corresponding to the first trenches, the second surface being opposite the first surface of the encapsulating member; forming conductive material in the second trenches, and electrically connecting the conductive material in the second trenches and the conductive material in the first trenches to cooperatively form at least one shielding structure in the first and the second trenches; separating the encapsulating member into a plurality of packaged units by cutting through the grounding structures of the encapsulating member; and forming an electromagnetic shielding layer on external surfaces of the packaged units with conductive material; wherein the electromagnetic shielding layer is electrically connected to the grounding pads.