| 发明名称 |
THROUGH-MESH-PLANE VIAS IN A MULTI-LAYERED PACKAGE |
| 摘要 |
In some embodiments, a multi-layered package includes a plurality of mesh planes. The multi-layered package includes at least one through-mesh-plane via positioned to traverse the plurality of mesh planes, wherein the at least one through-mesh-plane via is to intersect the plurality of mesh planes. The multi-layered package includes at least one signal via positioned to traverse the plurality of mesh planes, wherein the at least one signal via is positioned within an opening of the plurality of mesh planes and is positioned adjacent to the at least one through through-mesh-plane via. |
| 申请公布号 |
US2015170996(A1) |
申请公布日期 |
2015.06.18 |
| 申请号 |
US201314132287 |
申请日期 |
2013.12.18 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Altabella Lazzi Dulce M.;Becker Wiren D.;Choi Jinwoo;Mandrekar Rohan U. |
| 分类号 |
H01L23/48;H01L21/768 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A multi-layered package comprising:
a plurality of mesh planes; at least one through-mesh-plane via positioned to traverse the plurality of mesh planes, wherein the at least one through-mesh-plane via is to intersect the plurality of mesh planes; and at least one signal via positioned to traverse the plurality of mesh planes, wherein the at least one signal via is positioned within an opening of the plurality of mesh planes and is positioned adjacent to the at least one through through-mesh-plane via. |
| 地址 |
Armonk NY US |
