SEMICONDUCTOR DEVICE

摘要

A semiconductor device of embodiment includes: a wiring substrate having a first surface, a second surface and a side surface; a semiconductor element mounted on the first surface; a sealing resin layer sealing the semiconductor element and the first surface; a conductive shield layer covering the sealing resin layer and the side surface; and plural vias. At least one via is electrically connected to the conductive shield layer, and the plural vias are each arranged along peripheral part of the wiring substrate. When plural predetermined vias arranged at one side part of the peripheral part of the wiring substrate are seen through thickness direction of the wiring substrate, width of area totally occupied by the plural predetermined vias in direction perpendicular to the side part is larger than width an area occupied by each of the predetermined vias as a single via in direction along the side part.

主权项

1. A semiconductor device, comprising:
a wiring substrate having a first surface, a second surface and a side surface, a semiconductor element mounted on the first surface; a sealing resin layer sealing the semiconductor element and the first surface; a conductive shield layer covering the sealing resin layer and the side surface; and plural vias each arranged along a peripheral part of the wiring substrate, at least one of the vias being electrically connected to the conductive shield layer, wherein when plural predetermined vias arranged at one side part of the peripheral part of the wiring substrate from among the plural vias are seen through a thickness direction of the wiring substrate, a width of an area totally occupied by the plural predetermined vias in a direction perpendicular to the side part is larger than a width of an area occupied by each of the predetermined vias as a single via in a direction along the side part.