ACTIVELY-COOLED SHADOW RING FOR HEAT DISSIPATION IN PLASMA CHAMBER

摘要

Methods of and apparatuses for dicing semiconductor wafers, each wafer having a plurality of integrated circuits, are described. In an example, a shadow ring assembly for a plasma processing chamber includes a shadow ring having an annular body and an inner opening. The shadow ring assembly further includes a cooling channel disposed in the annular body for cooling fluid transport. The cooling channel is coupled to a pair of supply/return openings at a surface of the annular body.

主权项

1. A shadow ring assembly for a plasma processing chamber, the shadow ring assembly comprising:
a shadow ring having an annular body and an inner opening, wherein the annular body of the shadow ring is for clamping a tape frame of a substrate carrier and for covering a portion of a substrate supported on the substrate carrier without contacting the substrate during processing of the substrate; and a cooling channel disposed internal to the annular body for cooling fluid transport, the cooling channel coupled to a pair of supply/return openings at a surface of the annular body and traveling the mid-circumference of the annular body from one of the pair of supply/return openings to the other of the pair of supply/return openings.