| 发明名称 |
SEMICONDUCTOR SYSTEM ASSEMBLIES AND METHODS OF OPERATION |
| 摘要 |
An exemplary semiconductor processing system may include a processing chamber and a first plasma source. The first plasma source may utilize a first electrode positioned externally to the processing chamber, and the first plasma source may be configured to generate a first plasma. The processing system may further comprise a second plasma source separate from the first plasma source that utilizes a second electrode separate from the first electrode. The second electrode may be positioned externally to the processing chamber, and the second plasma source may be configured to generate a second plasma within the processing chamber. The processing system may further comprise a showerhead disposed between the relative locations of the first plasma electrode and the second plasma electrode. |
| 申请公布号 |
US2015170943(A1) |
申请公布日期 |
2015.06.18 |
| 申请号 |
US201314108719 |
申请日期 |
2013.12.17 |
| 申请人 |
Applied Materials, Inc. |
发明人 |
Nguyen Andrew;Ramaswamy Kartik;Nemani Srinivas;Howard Bradley;Vishwanath Yogananada Sarode |
| 分类号 |
H01L21/67;H01L21/3065 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor processing system comprising:
a processing chamber; a first plasma source utilizing a first electrode positioned externally to the processing chamber, wherein the first plasma source is configured to generate a first plasma; a second plasma source separate from the first plasma source, wherein the second plasma source utilizes a second electrode separate from the first electrode, wherein the second electrode is positioned externally to the processing chamber, and wherein the second plasma source is configured to generate a second plasma within the processing chamber; and a first showerhead disposed between the relative locations of the first plasma electrode and the second plasma electrode. |
| 地址 |
Santa Clara CA US |
