LOW DEFLECTION SPUTTERING TARGET ASSEMBLY AND METHODS OF MAKING SAME

摘要

Described is a design and method for producing a sputtering target assembly with low deflection made from target material solder bonded to composite backing plate with coefficient of thermal expansion (CTE) matching the target material. The composite backing plate is composite configuration composed of at least two different materials with different CTE. The composite backing plate, after plastic deformation, if necessary, has a CTE matching the target material and low and desirable deflection in the bonding process, and therefore, resulting in a low deflection and low stress target material bonded to composite backing plate assembly. The method includes manufacturing composite backing plate with a flat bond surface, heat treating of target blank and composite backing plate to achieve desirable shape of bond surfaces, solder bonding target to a backing plate, and slowly cooling the assembly to room temperature. Matching CTE in both target material and backing plate eliminates the problem of CTE mismatch and prevents the assembly from deflection and internal stress.

主权项

1. A method of producing a sputtering target assembly, said method comprising the steps of:
a. providing a backing plate composed of a laminated assembly comprising a first layer having a first coefficient of thermal expansion (CTE) and a second layer having a second CTE; b. providing a sputtering target, said target composed of a third material having third CTE; c. solder bonding said first layer of said backing plate to said target to provide said sputtering target assembly.