| 摘要 |
Provided is a radiation detection apparatus wherein a bonding failure between end portions of a plurality of sensor substrates and a bonding member is suppressed. This radiation detection apparatus has: a plurality of sensor substrates, which are disposed adjacent to each other, and each of which has a side surface that connects a first surface and a second surface facing the first surface, said first surface having a plurality of photoelectric conversion elements disposed thereon in an array; a scintillator that is disposed on the first surface side of the sensor substrates; and a sheet-like bonding member for bonding the sensor substrates and the scintillator to each other. Between the sensor substrates, the bonding member is bonded to at least a part of the first surface and a part of the side surface such that the bonding member is continuously bonded over at least a part of the side surface from the first surface. |
